Intel China announces the expansion of its Chengdu packaging and testing facility · TechNode
Intel China announces the expansion of its Chengdu packaging and testing facility · TechNode

2025-04-28 06:27:29

Intel announced in Beijing that it will expand its Chengdu packaging and testing facility, making the capital of southwest China’s Sichuan province its supply chain base. The facility will package and test chips and work to improve support for Chinese customers. Intel remarked that “Chengdu, as a key city driving high-quality development in the western region, offers a friendly business environment.” The company has been based in Chengdu for over 20 years, participating in the local ecosystem and community development. According to Wang Rui, president of Intel China, “The expansion of the Chengdu facility marks a milestone for Intel in deepening cooperation with the industry.” [Intel China, in Chinese]

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